CXMT claims breakthrough in 4F² memory cell architecture, prepares server DRAM for late 2026
Chinese memory maker CXMT announced "key progress" in developing a 4F² cell architecture that boosts memory density. Company president Cao Kanyu said at an industry event in Shanghai on October 12 that CXMT plans to launch a server DRAM product based on the technology by the end of 2026. Global rivals Samsung Electronics and SK Hynix are working on similar advances. - The 4F² architecture means each cell occupies an area of four F squares, where F is the minimum width of a semiconductor line - Higher density allows more cells to fit on a single die, lowering memory costs and improving energy efficiency - CXMT plans to commercialize the technology in a server DRAM product by the end of this year
AI-processed from SCMP Tech; edited by Hamidun News
Chinese memory manufacturer ChangXin Memory Technologies (CXMT) announced "key progress" in developing a new memory cell architecture aimed at boosting on-die storage density. Company president Cao Kanyu revealed the news at an industry event in Shanghai on October 12, 2026.
Global memory market leaders Samsung Electronics and SK Hynix are working on the same front, so CXMT's announcement underscores intensifying competition in a sector that's critical to digital infrastructure.
4F² technology: architecture of the future
At the center of the development is the "4F square" (4F²) architecture. The technology works like this: each memory cell occupies an area equal to four F squares, where F denotes the minimum width of a semiconductor line. This parameter defines the manufacturing process node and sets the proportions of all other dimensions on the die.
Boosting memory density through innovative cell architectures is one of the key ways manufacturers achieve performance gains while cutting production costs. More cells on a single die means more memory without a proportional increase in die area. The result: cheaper memory per unit of information and improved system energy efficiency.
Commercializing server DRAM by the end of 2026
CXMT plans to launch a new server DRAM product based on the 4F² architecture by the end of 2026. Server DRAM is a critical component for cloud data centers and enterprise infrastructure worldwide.
A successful commercial rollout by CXMT could significantly reshape the competitive landscape of the memory market. Samsung Electronics and SK Hynix, the current industry leaders, are also pursuing the same wave of density-boosting innovation. However, being first to ship a successful commercial product could give CXMT a tactical advantage and increase its market share in the critical server memory segment for cloud and enterprise infrastructure.
Key Questions Answered
What are the key details on 4F² technology: architecture of the future?
At the center of the development is the "4F square" (4F²) architecture. The technology works like this: each memory cell occupies an area equal to four F squares, where F denotes the minimum width of a semiconductor line. This parameter defines the manufacturing process node and sets the proportions of all other dimensions on the die. Boosting memory density through innovative cell architectures is one of the key ways manufacturers achieve performance gains while cutting production costs. More cells on a single die means more memory without a proportional increase in die ar
What are the key details on Commercializing server DRAM by the end of 2026?
CXMT plans to launch a new server DRAM product based on the 4F² architecture by the end of 2026. Server DRAM is a critical component for cloud data centers and enterprise infrastructure worldwide. A successful commercial rollout by CXMT could significantly reshape the competitive landscape of the memory market. Samsung Electronics and SK Hynix, the current industry leaders, are also pursuing the same wave of density-boosting innovation. However, being first to ship a successful commercial product could give CXMT a tactical advantage and increase its market share in the crit
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